Electrode Substrate - List of Manufacturers, Suppliers, Companies and Products

Electrode Substrate Product List

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Diagonal comb-shaped electrode substrate

Diagonal comb-shaped electrode substrate

Limited quantity for shipment! Line & Space 4μm/10.5μm

We would like to introduce the "Diagonal Comb Electrode Substrate" handled by EHC Corporation. This is a test substrate with an ITO pattern that has a 15° tilt, with a line and space of 4μm/10.5μm. It is a limited quantity product. The glass substrate material is EAGLE-XG, and the substrate glass size is 30x35x0.7mm. The electrode material is ITO, and the electrode film thickness is 70nm. 【Specifications】 ■ Glass substrate material: EAGLE-XG ■ Substrate glass size: 30x35x0.7mm ■ Electrode material: ITO ■ Electrode film thickness: 70nm ■ Electrode line width: 4μm ■ Electrode space: 10.5μm *For more details, please download the PDF or feel free to contact us.

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End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the edge of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide through holes with burr-free end faces.

We would like to introduce our "Narrow Pitch Edge Through-Hole Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter boards ■ Module boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "Partial etching through-hole substrate"

End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! We can accommodate board thicknesses from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

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